4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Nobuo Kamehara

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Bump-forming method using two plates and electronic device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Composition for the formation of ceramic vias

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Making composite or hollow article
Patent

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Epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Patent

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Immersion cooling coolant

Compositions – Vaporization – or expansion – refrigeration or heat or energy...
Reexamination Certificate

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Immersion cooling coolant and electronic device using this coola

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Profile ID: LFUS-PAI-P-313961

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