Methods of improving photoresist adhesion for integrated circuit

Details Methods of improving photoresist adhesion for integrated circuit Methods of improving photoresist adhesion for integrated circuit

1997-10-31

1999-12-21

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430327, 438964, 438974, 427307, G03F 700

Patent

active

060047291

ABSTRACT:
A method of forming an integrated circuit device includes the steps of forming a conductive pattern on an integrated circuit device, and forming an insulating layer on the conductive pattern and on the integrated circuit substrate. An upper surface portion of the insulating layer opposite the substrate is removed, and a photoresist layer is formed on the insulating layer after the step of removing the upper surface portion. The photoresist layer is patterned, and exposed portions of the insulating layer are etched using the patterned photoresist layer as an etching mask thereby forming contact holes through the insulating layer.

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