Apparatus for transferring solder bumps and method of using

Details Apparatus for transferring solder bumps and method of using Apparatus for transferring solder bumps and method of using

1998-04-30

1999-12-21

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 41, 228 447, B23K 300, B23K 3102

Patent

active

060037571

ABSTRACT:
An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.

REFERENCES:
patent: 5201451 (1993-04-01), Desai et al.
patent: 5632437 (1997-05-01), Vongfuangfoo et al.
patent: 5816482 (1998-10-01), Grabbe

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