Method for making alignment mark on substrate

Details Method for making alignment mark on substrate Method for making alignment mark on substrate

2009-12-10

2011-12-06

McPherson, John A. (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S321000

Reexamination Certificate

active

08071276

ABSTRACT:
An exemplary method for making an alignment mark on a substrate includes the following steps. First, a substrate with a recess is provided. Second, a photoresist layer is formed on a surface of the substrate including in the recess. Third, the photoresist layer is exposed and developed to leave a body of remaining photoresist in the recess, with the body of remaining photoresist protruding above the surface of the substrate. Fourth, a metal layer is formed in an unfilled area of the recess and on the surface of the substrate, with the metal layer substantially surrounding the remaining photoresist. Finally, the remaining photoresist is removed to form an alignment mark in the metal layer on the substrate.

REFERENCES:
patent: 6979526 (2005-12-01), Ning
patent: 2002/0192926 (2002-12-01), Schroeder et al.
patent: 2008/0305439 (2008-12-01), Khan

Affiliated with

Also associated with

Rating

Method for making alignment mark on substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making alignment mark on substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making alignment mark on substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4315612