Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-11-05
2011-11-08
Chawan, Sheela (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S147000, C382S149000, C356S237100, C356S237400
Reexamination Certificate
active
08055056
ABSTRACT:
In a method of detecting defects of patterns on a semiconductor substrate and an apparatus for performing the method information on positions of reference defects influencing an operation of a circuit including the patterns when the patterns are formed on the semiconductor substrate is acquired in advance. Preliminary defects of the patterns formed on the semiconductor substrate are detected. Positions of the preliminary defects of the patterns are compared with positions of the reference defects. The preliminary defects having the positions substantially the same as the positions of the reference defects are set to be defects of the patterns so that the actual defects are detected.
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patent: 06-036016 (1994-02-01), None
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Jun Chung-Sam
Kang Moon-Shik
Kim Ji-Hye
Kim Jong-An
Yang Yu-Sin
Chawan Sheela
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
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