Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2010-12-10
2011-11-01
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C257SE21599
Reexamination Certificate
active
08048778
ABSTRACT:
An embodiment of the disclosure includes a method of dicing a semiconductor structure. A device layer on a semiconductor substrate is provided. The device layer has a first chip region and a second chip region. A scribe line region is between the first chip region and the second chip region. A protective layer is formed over the device layer thereby over the semiconductor substrate. The protective layer on the scribe line region is laser sawn to form a notch. The notch extends into the semiconductor substrate and the protective layer is formed to cover a portion of the notch. A mechanically sawing is performed through the portion of the protective layer and the substrate to separate the first chip region and the second chip region.
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Chiu Sheng-Hsiang
Ku Chin-Yu
Lien Young-Chang
Lin Chun-Ying
Yu Hsiu-Mei
Enad Christine
Lowe Hauptman & Ham & Berner, LLP
Nguyen Khiem D
Taiwan Semiconductor Manufacturing Company , Ltd.
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