Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-05-03
2010-06-08
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S686000
Reexamination Certificate
active
07732254
ABSTRACT:
A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a first package including a first package substrate and having a die-up flip chip configuration, affixing a second package including a second package substrate an upper surface of the first package, and forming z-interconnects between the first and second package substrates.
REFERENCES:
patent: 5247423 (1993-09-01), Lin et al.
patent: 5652185 (1997-07-01), Lee
patent: 6238949 (2001-05-01), Nguyen et al.
patent: 6441496 (2002-08-01), Chen et al.
patent: 6441498 (2002-08-01), Song
patent: 6445064 (2002-09-01), Ishii et al.
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6593662 (2003-07-01), Pu et al.
patent: 6603072 (2003-08-01), Foster et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6690089 (2004-02-01), Uchida
patent: 6847105 (2005-01-01), Koopmans
patent: 6864566 (2005-03-01), Choi
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 6930396 (2005-08-01), Kurita et al.
patent: 6933598 (2005-08-01), Karnezos
patent: 7034387 (2006-04-01), Karnezos
patent: 7045887 (2006-05-01), Karnezos
patent: 7049691 (2006-05-01), Karnezos
patent: 7053476 (2006-05-01), Karnezos
patent: 7057269 (2006-06-01), Karnezos
patent: 7061088 (2006-06-01), Karnezos
patent: 7064426 (2006-06-01), Karnezos
patent: 7071568 (2006-07-01), St. Amand et al.
patent: 7081678 (2006-07-01), Liu
patent: 7101731 (2006-09-01), Karnezos
patent: 7119427 (2006-10-01), Kim
patent: 2002/0022301 (2002-02-01), Kwon et al.
patent: 2002/0096755 (2002-07-01), Fukui et al.
patent: 2003/0047798 (2003-03-01), Halahan
patent: 2004/0212096 (2004-10-01), Wang
patent: 2006/0043556 (2006-03-01), Su et al.
patent: 2006/0138631 (2006-06-01), Tao et al.
patent: 11-243175 (1999-09-01), None
patent: 2000-294723 (2000-10-01), None
patent: 2000-340736 (2000-12-01), None
Chippac Inc.
Lee Calvin
LandOfFree
Semiconductor multi-package module having package stacked... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor multi-package module having package stacked..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor multi-package module having package stacked... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4233478