Semiconductor device with test pads and pad connection unit

Details Semiconductor device with test pads and pad connection unit Semiconductor device with test pads and pad connection unit

2007-12-20

2010-11-16

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S734000, C257SE21521, C257SE21522, C257SE21526, C438S014000

Reexamination Certificate

active

07834350

ABSTRACT:
A semiconductor device includes at least one first type of pad and at least one second type of pad having a different area from the first type of pad. A pad connection unit electrically couples the at least one second type of pad to an integrated circuit of the semiconductor device during a test mode, and disconnects the at least one second type of pad from the integrated circuit during a normal operating mode.

REFERENCES:
patent: 5286656 (1994-02-01), Keown et al.
patent: 5920765 (1999-07-01), Naum et al.
patent: 6127729 (2000-10-01), Fukuda
patent: 2004/0238818 (2004-12-01), Kim
Korean Patent Application No. 1020040111254 to Chuan et al., having Publication date of Jun. 28, 2006 (w/ English Abstract page).
Korean Patent Application No. 1020030015696 to Kim, having Publication date of Sep. 20, 2004 (w/ English Abstract page).
Japanese Patent Application No. 2000-400831 to Yoshiyuki et al., having Publication date of Jul. 19, 2002 (w/ English Abstract page).
Japanese Patent Application No. 2005-073682 to Shigeyuki, having Publication date of Oct. 27, 2005 (w/ English Abstract page).

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