Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-10-01
2010-11-16
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S296000, C257S330000, C257SE21429
Reexamination Certificate
active
07833861
ABSTRACT:
A semiconductor device having a recess channel structure includes a semiconductor substrate having a recess formed in a gate forming area in an active area; an insulation layer formed in the semiconductor substrate so as to define the active area and formed so as to apply a tensile stress in a channel width direction; a stressor formed in a surface of the insulation layer and formed so as to apply a compressive stress in a channel height direction; a gate formed over the recess in the active area; and source/drain areas formed in a surface of the active area at both side of the gate.
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Goto et al., “High Performance 35 nm Gate CMOSFETs with Vertical Scaling and Total Stress Control for 65 nm Technology,”2003 Symposium on VLSI Technology Digest of Technical Papers, pp. 49-50.
Hynix / Semiconductor Inc.
Taylor Earl N
Townsend and Townsend / and Crew LLP
Vu David
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