Heat sink with preattached thermal interface material and...

Details Heat sink with preattached thermal interface material and... Heat sink with preattached thermal interface material and...

2008-03-07

2010-10-26

Geyer, Scott B (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

Reexamination Certificate

active

07821126

ABSTRACT:
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.

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