4. Static structures (e.g., buildings)
  5. Window or window sash, sill, mullion, or glazing
  6. Spacing pane from disparate edging

Sabina J. Houle

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Apparatus and method for containing excess thermal interface...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Apparatus to compensate for stress between heat spreader and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Apparatus to compensate for stress between heat spreader and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Carbon-carbon and/or metal-carbon fiber composite heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Carbon-carbon and/or metal-carbon fiber composite heat...

Heat exchange – Heat transmitter
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1191218

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