Microelectronic structure by selective deposition

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S288000, C257S347000, C257S365000

Reexamination Certificate

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07816743

ABSTRACT:
A finFET structure includes a semiconductor fin located over a substrate. A gate electrode is located traversing the semiconductor fin. The gate electrode has a spacer layer located adjoining a sidewall thereof. The spacer layer does not cover completely a sidewall of the semiconductor fin. The gate electrode and the spacer layer may be formed using a vapor deposition method that provides for selective deposition upon a sidewall of a mandrel layer but not upon an adjoining surface of the substrate, so that the spacer layer does not cover completely the sidewall of the semiconductor fin. Other microelectronic structures may be fabricated using the lateral growth methodology.

REFERENCES:
patent: 7229889 (2007-06-01), Holmes et al.
patent: 7384838 (2008-06-01), Hsu et al.
patent: 7387974 (2008-06-01), Holmes et al.
patent: 2006/0097310 (2006-05-01), Kim et al.
Gordon, et al., “Vapor Deposition of Metal Oxides and Silicates: Possible Gate Insulators for Future Microelectronics” 2001 Chemical Society, Chem. Mater., Jul. 10, 2001, pp. 2463-3464, vol 13, No. 8 published on Web.
Jain et al., “Control of selectivity during chemical vapor deposition of copper from copper (I) compounds via silicon dioxide surface modification”, Appl. Phys. Lett. 61 (22), Nov. 30, 1992, pp. 2662-2664.
Fail, et al., “Controlled Attachment of PAMAM Dendrimers to Solid Surfaces”, 2002 American Chemical Society, Dec. 16, 2001, pp. 264-268, Published on Web.
Hausmann, et al., “Rapid Vapor Deposition of Highly Conformal Silica Nanolaminates”, Oct. 11, 2002, pp. 402-406, vol. 298, Science.
Becker, et al., “Diffusion barrier properties of tungsten nitride films grown by atomic layer deposition from bis(tert-butylimido)bis(dimethylamido)tungsten and ammonia,” Applied Physics Letters, Apr. 7, 2003, pp. 2239-2241, vol. 82, No. 14; downloaded Nov. 25, 2003 to 128.103.60.225.
Gordon, et al., “Vapor Deposition of Metal Oxides and Silicates: Possible Gate Insulators for Future Microelectronics” 2001 Chemical Society, Chem. Mater., Jul. 10, 2001, pp. 2463-2464, vol. 13, No. 8, published on Web.
Utriainen, et al., “Studies of metallic thin film growth in an atomic layer epitaxy reactor using M(acac)2 (M=Ni, Cu, Pt) precursors”, Applied Surface Science 157 (2000) pp. 151-158.
Scmaltianos, et al., “Copper nucleation by chemical vapour deposition on organosilane treated SiO2 surfaces”, Surface Science 562 (2004), pp157-169.
Lim, et al., “Synthesis and Characterization of Volatile, Thermally Stable, Reactive Transition Metal Amidinates”, Inorganic Chemistry 2003, pp. 7951-7958, vol. 42, No. 24.
Yokoyama, et al., “Atomic-layer selective deposition of silicon nitride on hydrogen-terminated Si surfaces”, Applied surface Science 130-132 (1998) pp. 352-356.
Jain, et al., “Control of selectivity during chemical vapor deposition of copper from copper (I) compounds via silicon dioxide surface modification”, Appl. Phys. Lett. 61 (22), Nov. 30, 1992, pp. 2662-2664.
Fail, et al., “Controlled Attachment of PAMAM Dendrimers to Solid Surfaces”, 2002 American Chemical Society, Dec. 6, 2001, pp. 264-268, Published on Web.
Hausmann, et al., “Rapid Vapor Deposition of Highly Conformal Silica Nanolaminates”, Oct. 11, 2002, pp. 402-406, vol. 298, Science.
Klaus, et al., “Atomic Layer Deposition of Tungsten Nitride Films Using Sequential Surface Reactions”, Journal of the Electrochemical Society, 147, (3) 1175-1181 (2000).
Marcinko, et al., “Hydrolytic Stability of Organic Monolayers Supported on TiO2 and ZrO2”, 2004 American Chemical Society; pp. 2270-2273.
Smith, et al., “Physical and electrical characterization of ALCVDTM TiN and WNxCy used as a copper diffusion barrier in dual damascene backend structures (08.2)”, 2002 Elsevier Science B.V. Microelectronic Engineering 64(202) 247-253.

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