Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-05-24
2010-02-09
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S433000, C438S424000, C438S425000, C438S201000, C438S257000, C438S435000, C438S721000, C257SE21548, C257S510000, C257S374000, C257S514000, C257S515000, C257S516000, C257S519000, C257SE21545, C257SE21546, C257SE21564
Reexamination Certificate
active
07659159
ABSTRACT:
In a method of fabricating a flash memory device, a semiconductor substrate includes a tunnel insulating layer and a charge storage layer formed in an active region and a trench formed in an isolation region. A first insulating layer is formed to fill a part of the trench. A second insulating layer is formed on the first insulating layer so that the trench is filled. The first and second insulating layers are removed such that the first and second insulating layers remain on sidewalls of the charge storage layer and on a part of the trench. A third insulating layer is formed on the first and second insulating layers so that a space defined by the charge storage layer is filled. The third insulating layer is removed so that a height of the third insulating layer is lowered.
REFERENCES:
patent: 5719085 (1998-02-01), Moon et al.
patent: 5969393 (1999-10-01), Noguchi
patent: 5981402 (1999-11-01), Hsiao et al.
patent: 6037018 (2000-03-01), Jang et al.
patent: 6150238 (2000-11-01), Wu et al.
patent: 6251735 (2001-06-01), Lou
patent: 6333274 (2001-12-01), Akatsu et al.
patent: 6376893 (2002-04-01), Rha
patent: 6465325 (2002-10-01), Ridley et al.
patent: 6504210 (2003-01-01), Divakaruni et al.
patent: 6531377 (2003-03-01), Knorr et al.
patent: 6544861 (2003-04-01), Joo
patent: 6566229 (2003-05-01), Hong et al.
patent: 6653204 (2003-11-01), Wu et al.
patent: 6667223 (2003-12-01), Seitz
patent: 6693050 (2004-02-01), Cui et al.
patent: 6720611 (2004-04-01), Jang
patent: 6743728 (2004-06-01), Ho et al.
patent: 6777725 (2004-08-01), Willer et al.
patent: 6780728 (2004-08-01), Tran
patent: 6797589 (2004-09-01), Adams et al.
patent: 6798038 (2004-09-01), Sato et al.
patent: 6833311 (2004-12-01), Ho et al.
patent: 6908831 (2005-06-01), O'Riain et al.
patent: 6939780 (2005-09-01), Yun et al.
patent: 6946359 (2005-09-01), Yang et al.
patent: 7033945 (2006-04-01), Byun et al.
patent: 7052970 (2006-05-01), Radecker
patent: 7056792 (2006-06-01), Lin
patent: 7122428 (2006-10-01), Jung et al.
patent: 7151295 (2006-12-01), Yaegashi et al.
patent: 7163863 (2007-01-01), Shone
patent: 7163869 (2007-01-01), Kim et al.
patent: 7166539 (2007-01-01), Fucsko et al.
patent: 7199022 (2007-04-01), Yasui et al.
patent: 7332409 (2008-02-01), Cha et al.
patent: 7364975 (2008-04-01), Culmsee et al.
patent: 7498233 (2009-03-01), Kim et al.
patent: 2002/0058381 (2002-05-01), Lee
patent: 2002/0072198 (2002-06-01), Ahn
patent: 2002/0080659 (2002-06-01), Shin et al.
patent: 2002/0081817 (2002-06-01), Bhakta et al.
patent: 2002/0171118 (2002-11-01), Mandelman et al.
patent: 2003/0013271 (2003-01-01), Knorr et al.
patent: 2003/0087506 (2003-05-01), Kirchhoff
patent: 2003/0178669 (2003-09-01), Kunori
patent: 2003/0235975 (2003-12-01), Tran
patent: 2004/0043560 (2004-03-01), Popp
patent: 2004/0058507 (2004-03-01), Ho et al.
patent: 2004/0058549 (2004-03-01), Ho et al.
patent: 2004/0126990 (2004-07-01), Ohta
patent: 2004/0203217 (2004-10-01), Lai et al.
patent: 2005/0116300 (2005-06-01), Hieda et al.
patent: 2005/0258463 (2005-11-01), Yaegashi et al.
patent: 2005/0266647 (2005-12-01), Kim et al.
patent: 2005/0287731 (2005-12-01), Bian et al.
patent: 2006/0011950 (2006-01-01), Akasaka
patent: 2006/0073661 (2006-04-01), Lee
patent: 2006/0094203 (2006-05-01), Choi et al.
patent: 2006/0246684 (2006-11-01), Hoshi et al.
patent: 2006/0264003 (2006-11-01), Eun
patent: 2006/0270170 (2006-11-01), Arisumi et al.
patent: 2007/0063258 (2007-03-01), Violette
patent: 2007/0087499 (2007-04-01), Seo et al.
patent: 2007/0131987 (2007-06-01), Kim
patent: 2007/0161233 (2007-07-01), Seok
patent: 2007/0173005 (2007-07-01), Lee
patent: 2007/0210403 (2007-09-01), Sandhu
patent: 2007/0241373 (2007-10-01), Kuroi et al.
patent: 2007/0284650 (2007-12-01), Willer
patent: 2008/0003739 (2008-01-01), Lee et al.
patent: 2008/0003766 (2008-01-01), Eun
patent: 2008/0003773 (2008-01-01), Kwak et al.
patent: 2008/0081411 (2008-04-01), Cho et al.
patent: 2008/0102578 (2008-05-01), Schlosser
patent: 2008/0206976 (2008-08-01), Kitamura et al.
patent: 2005-332885 (2005-12-01), None
patent: 2006-286720 (2006-10-01), None
patent: 1020040053441 (2004-06-01), None
Hynix / Semiconductor Inc.
Singal Ankush K
Toledo Fernando L
Townsend and Townsend / and Crew LLP
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