Method of fabricating a semiconductor device with a dopant...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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Details

C438S643000, C438S660000, C257S751000, C257S758000, C257S774000, C257SE21584

Reexamination Certificate

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07629239

ABSTRACT:
A semiconductor device and a method of fabricating the same are disclosed. The semiconductor device includes a lower wire, an interlayer insulating film formed on the lower wire and having a via hole exposing the upper surface of the lower wire, a diffusion barrier formed on the inner wall of the via hole, and an upper wire filling the via hole and directly contacting the lower wire, in which a dopant region containing a component of the diffusion barrier is formed in the lower wire in the extension direction of the via hole.

REFERENCES:
patent: 6100184 (2000-08-01), Zhao et al.
patent: 6548905 (2003-04-01), Park et al.
patent: 6797619 (2004-09-01), Jang et al.
patent: 6884710 (2005-04-01), Park et al.
patent: 7482684 (2009-01-01), Oh et al.
patent: 2002/0109234 (2002-08-01), Park et al.
patent: 2003/0111735 (2003-06-01), Lee
patent: 2003/0160331 (2003-08-01), Fujisawa
patent: 2003249547 (2003-09-01), None
patent: 10-0385227 (2003-05-01), None
patent: 10-0413828 (2003-12-01), None

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