Semiconductor substrate having reference semiconductor chip...

Details Semiconductor substrate having reference semiconductor chip... Semiconductor substrate having reference semiconductor chip...

2006-01-20

2009-11-17

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S975000, C209S573000, C700S121000, C702S081000, C257S797000, C257SE23179, C257SE21524, C257SE21525

Reexamination Certificate

active

07618832

ABSTRACT:
A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The semiconductor substrate is aligned with reference to the reference semiconductor chip, so that an electrical die sorting test can be performed on the semiconductor chips on the semiconductor substrate.

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