Laser processing method for trench-edge-defect-free solid...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S198000, C438S424000, C257SE21347

Reexamination Certificate

active

07547616

ABSTRACT:
The present invention provides an improved amorphization/templated recrystallization (ATR) method for fabricating low-defect-density hybrid orientation substrates. ATR methods for hybrid orientation substrate fabrication generally start with a Si layer having a first orientation bonded to a second Si layer or substrate having a second orientation. Selected regions of the first Si layer are amorphized and then recrystallized into the orientation of the second Si layer by using the second Si layer as a template. In particular, this invention provides a melt-recrystallization ATR method, for use alone or in combination with non-melt-recrystallization ATR methods, in which selected Si regions bounded by dielectric-filled trenches are induced to undergo an orientation change by the steps of preamorphization, laser-induced melting, and corner-defect-free templated recrystallization from the melt.

REFERENCES:
patent: 4385937 (1983-05-01), Ohmura
patent: 4768076 (1988-08-01), Aoki et al.
patent: 4816893 (1989-03-01), Mayer et al.
patent: 6172381 (2001-01-01), Gardner et al.
patent: 6759303 (2004-07-01), Cartagena
patent: 6774390 (2004-08-01), Sugiyama
patent: 7060585 (2006-06-01), Cohen et al.
patent: 2004/0195646 (2004-10-01), Yeo et al.
patent: 2004/0256700 (2004-12-01), Doris et al.
patent: 2005/0116290 (2005-06-01), De Souza et al.
patent: 2006/0154429 (2006-07-01), de Souza et al.
patent: 0331811 (1989-09-01), None
patent: 0535681 (1993-04-01), None
patent: 1174928 (2002-01-01), None
patent: 60-154548 (1985-08-01), None
patent: 1-162362 (1989-06-01), None
Burbure, N., et al., “The effect of oxide trenches on defect formation and evolution in ion-implanted silicon,” Mat. Res. Soc. Symp Proc., vol. 810, C 4.19, 2004 Materials Research Society.
Yang, M., et al. “High Performance CMOS Fabricated on Hybird Substrate with Different Crystal Orientations,” IEDM 2003 Paper 18.7.
Jones, K.S., et al., “Effect of implant temperature on transient enhanced diffusion of boron in regrown silicon after amorphization by Si+ or Ge+ implantation,” J. Appl. Phys. 81, 6051, 1997.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser processing method for trench-edge-defect-free solid... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser processing method for trench-edge-defect-free solid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser processing method for trench-edge-defect-free solid... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4098294

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.