Single spacer process for multiplying pitch by a factor...

Details Single spacer process for multiplying pitch by a factor... Single spacer process for multiplying pitch by a factor...

2006-08-30

2009-11-03

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S424000, C438S702000, C438S942000, C438S947000, C257S435000, C257S797000, C257S798000, C257SE21023, C257SE21035, C257SE21038, C257SE21240

Reexamination Certificate

active

07611980

ABSTRACT:
Single spacer processes for multiplying pitch by a factor greater than two are provided. In one embodiment, n, where n≧2, tiers of stacked mandrels are formed over a substrate, each of the n tiers comprising a plurality of mandrels substantially parallel to one another. Mandrels at tier n are over and parallel to mandrels at tier n−1, and the distance between adjoining mandrels at tier n is greater than the distance between adjoining mandrels at tier n−1. Spacers are simultaneously formed on sidewalls of the mandrels. Exposed portions of the mandrels are etched away and a pattern of lines defined by the spacers is transferred to the substrate.

REFERENCES:
patent: 4234362 (1980-11-01), Riseman
patent: 4419809 (1983-12-01), Riseman et al.
patent: 4432132 (1984-02-01), Kinsbron et al.
patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4508579 (1985-04-01), Goth et al.
patent: 4648937 (1987-03-01), Ogura et al.
patent: 4716131 (1987-12-01), Okazawa et al.
patent: 4776922 (1988-10-01), Bhattacharyya et al.
patent: 4838991 (1989-06-01), Cote et al.
patent: 5013680 (1991-05-01), Lowrey et al.
patent: 5047117 (1991-09-01), Roberts
patent: 5053105 (1991-10-01), Fox, III
patent: 5117027 (1992-05-01), Bernhardt et al.
patent: 5328810 (1994-07-01), Lowrey et al.
patent: 5330879 (1994-07-01), Dennison
patent: 5470661 (1995-11-01), Bailey et al.
patent: 5514885 (1996-05-01), Myrick
patent: 5670794 (1997-09-01), Manning
patent: 5753546 (1998-05-01), Koh et al.
patent: 5789320 (1998-08-01), Andricacos et al.
patent: 5795830 (1998-08-01), Cronin et al.
patent: 5830332 (1998-11-01), Babich et al.
patent: 5899746 (1999-05-01), Mukai
patent: 5998256 (1999-12-01), Juengling
patent: 6004862 (1999-12-01), Kim et al.
patent: 6010946 (2000-01-01), Hisamune et al.
patent: 6042998 (2000-03-01), Brueck et al.
patent: 6057573 (2000-05-01), Kirsch et al.
patent: 6063688 (2000-05-01), Doyle et al.
patent: 6071789 (2000-06-01), Yang et al.
patent: 6110837 (2000-08-01), Linliu et al.
patent: 6143476 (2000-11-01), Ye et al.
patent: 6211044 (2001-04-01), Xiang et al.
patent: 6288454 (2001-09-01), Allman et al.
patent: 6291334 (2001-09-01), Somekh
patent: 6297554 (2001-10-01), Lin
patent: 6335257 (2002-01-01), Tseng
patent: 6348380 (2002-02-01), Weimer et al.
patent: 6362057 (2002-03-01), Taylor, Jr. et al.
patent: 6383907 (2002-05-01), Hasegawa et al.
patent: 6395613 (2002-05-01), Juengling
patent: 6423474 (2002-07-01), Holscher
patent: 6455372 (2002-09-01), Weimer
patent: 6514884 (2003-02-01), Maeda
patent: 6522584 (2003-02-01), Chen et al.
patent: 6534243 (2003-03-01), Templeton
patent: 6548396 (2003-04-01), Naik et al.
patent: 6559017 (2003-05-01), Brown et al.
patent: 6566280 (2003-05-01), Meagley et al.
patent: 6573030 (2003-06-01), Fairbairn et al.
patent: 6602779 (2003-08-01), Li et al.
patent: 6632741 (2003-10-01), Clevenger et al.
patent: 6638441 (2003-10-01), Chang et al.
patent: 6667237 (2003-12-01), Metzler
patent: 6673684 (2004-01-01), Huang et al.
patent: 6686245 (2004-02-01), Mathew et al.
patent: 6689695 (2004-02-01), Lui et al.
patent: 6706571 (2004-03-01), Yu et al.
patent: 6709807 (2004-03-01), Hallock et al.
patent: 6734107 (2004-05-01), Lai et al.
patent: 6744094 (2004-06-01), Forbes
patent: 6773998 (2004-08-01), Fisher et al.
patent: 6794699 (2004-09-01), Bissey et al.
patent: 6800930 (2004-10-01), Jackson et al.
patent: 6835662 (2004-12-01), Erhardt et al.
patent: 6867116 (2005-03-01), Chung
patent: 6875703 (2005-04-01), Furukawa et al.
patent: 6893972 (2005-05-01), Rottstegge et al.
patent: 6924191 (2005-08-01), Liu et al.
patent: 6962867 (2005-11-01), Jackson et al.
patent: 7015124 (2006-03-01), Fisher et al.
patent: 7074668 (2006-07-01), Park et al.
patent: 7183205 (2007-02-01), Hong
patent: 7183597 (2007-02-01), Doyle
patent: 7208379 (2007-04-01), Venugopal et al.
patent: 7288445 (2007-10-01), Bryant et al.
patent: 7291560 (2007-11-01), Parascandola et al.
patent: 2002/0042198 (2002-04-01), Bjarnason et al.
patent: 2002/0045308 (2002-04-01), Juengling
patent: 2002/0063110 (2002-05-01), Cantell et al.
patent: 2002/0068243 (2002-06-01), Hwang et al.
patent: 2002/0127810 (2002-09-01), Nakamura
patent: 2003/0006410 (2003-01-01), Doyle
patent: 2003/0044722 (2003-03-01), Hsu et al.
patent: 2003/0109102 (2003-06-01), Kujirai et al.
patent: 2003/0119307 (2003-06-01), Bekiaris et al.
patent: 2003/0127426 (2003-07-01), Chang et al.
patent: 2003/0157436 (2003-08-01), Manger et al.
patent: 2003/0207207 (2003-11-01), Li
patent: 2003/0207584 (2003-11-01), Sivakumar et al.
patent: 2003/0216050 (2003-11-01), Golz et al.
patent: 2003/0230234 (2003-12-01), Nam et al.
patent: 2004/0000534 (2004-01-01), Lipinski
patent: 2004/0017989 (2004-01-01), So
patent: 2004/0018738 (2004-01-01), Liu
patent: 2004/0023475 (2004-02-01), Bonser et al.
patent: 2004/0023502 (2004-02-01), Tzou et al.
patent: 2004/0041189 (2004-03-01), Voshell et al.
patent: 2004/0043623 (2004-03-01), Liu et al.
patent: 2004/0053475 (2004-03-01), Sharma
patent: 2004/0079988 (2004-04-01), Harari
patent: 2004/0106257 (2004-06-01), Okamura et al.
patent: 2004/0235255 (2004-11-01), Tanaka et al.
patent: 2005/0074949 (2005-04-01), Jung et al.
patent: 2005/0112886 (2005-05-01), Asakawa et al.
patent: 2005/0142497 (2005-06-01), Ryou
patent: 2005/0153562 (2005-07-01), Furukawa et al.
patent: 2005/0164454 (2005-07-01), Leslie
patent: 2005/0167394 (2005-08-01), liu et al.
patent: 2005/0186705 (2005-08-01), Jackson et al.
patent: 2005/0272259 (2005-12-01), Hong
patent: 2006/0003182 (2006-01-01), Lane et al.
patent: 2006/0024940 (2006-02-01), Furukawa et al.
patent: 2006/0024945 (2006-02-01), Kim et al.
patent: 2006/0046161 (2006-03-01), Yin et al.
patent: 2006/0046200 (2006-03-01), Abatchev et al.
patent: 2006/0046201 (2006-03-01), Sandhu et al.
patent: 2006/0046422 (2006-03-01), Tran et al.
patent: 2006/0046484 (2006-03-01), Abatchev et al.
patent: 2006/0083996 (2006-04-01), Kim
patent: 2006/0172540 (2006-08-01), Marks et al.
patent: 2006/0189150 (2006-08-01), Jung
patent: 2006/0211260 (2006-09-01), Tran et al.
patent: 2006/0216923 (2006-09-01), Tran et al.
patent: 2006/0231900 (2006-10-01), Lee et al.
patent: 2006/0263699 (2006-11-01), Abatchev et al.
patent: 2006/0267075 (2006-11-01), Sandhu et al.
patent: 2006/0273456 (2006-12-01), Sant et al.
patent: 2006/0281266 (2006-12-01), Wells
patent: 2007/0026672 (2007-02-01), Tang et al.
patent: 2007/0045712 (2007-03-01), Haller et al.
patent: 2007/0048674 (2007-03-01), Wells
patent: 2007/0049011 (2007-03-01), Tran
patent: 2007/0049030 (2007-03-01), Sandhu et al.
patent: 2007/0049032 (2007-03-01), Abatchev et al.
patent: 2007/0049035 (2007-03-01), Tran
patent: 2007/0049040 (2007-03-01), Bai et al.
patent: 2007/0050748 (2007-03-01), Juengling
patent: 2007/0210449 (2007-09-01), Caspary et al.
patent: 2007/0215960 (2007-09-01), Zhu et al.
patent: 2007/0275309 (2007-11-01), Liu
patent: 2008/0054350 (2008-03-01), Breitwisch et al.
patent: 42 36 609 (1994-05-01), None
patent: 0227303 (1987-07-01), None
patent: 0491408 (1992-06-01), None
patent: 1357433 (2003-10-01), None
patent: 05343370 (1993-12-01), None
patent: H8-55908 (1996-02-01), None
patent: H8-55920 (1996-02-01), None
patent: 1999-0001440 (1999-01-01), None
patent: 1999-027887 (1999-04-01), None
patent: WO 94/15261 (1994-07-01), None
patent: WO 02/099864 (2002-12-01), None
patent: WO 2004/001799 (2003-12-01), None
patent: WO 2004/003977 (2004-01-01), None
patent: WO 2005/034215 (2005-04-01), None
patent: WO 2006/026699 (2006-03-01), None
Bruek, “Optical and Interferometric Lithography—Nanotechnology Enablers,” 2005, Proceedings of the IEEE, vol. 93 No. 10, pp. 1704-1721.
Sheats et al., “Microlithography: Science and Technology,” 1998, Marcel Dekker Inc., pp. 104-105.
“U.S. Appl. No. 11/543,515, filed Oct. 24, 2006, Micron Ref. No. 2005-1173.00/US.”.
Ex Parte Cantell, unpublished decision of the Board of Patent Appeals and Interferences, Mar. 4, 2005.
Choi et al., “Sublithographic nanofabrication technology for nanocatalysts and DNA chips,”J.Vac. Sci. Technol., pp. 295

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