High-k thin film grain size control

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S003000, C438S396000, C438S778000, C257S310000, C257S532000, C257SE39009, C257SE31051, C977S773000

Reexamination Certificate

active

07629269

ABSTRACT:
A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate comprising at least one capacitor structure formed on a surface, the capacitor structure comprising a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material comprises columnar grains.

REFERENCES:
patent: 4241378 (1980-12-01), Dorrian
patent: 4458295 (1984-07-01), Durschlag et al.
patent: 4528613 (1985-07-01), Stetson et al.
patent: 4687540 (1987-08-01), Singhdeo et al.
patent: 4702967 (1987-10-01), Black et al.
patent: 5065275 (1991-11-01), Fujisaki et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5160762 (1992-11-01), Brand et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5191510 (1993-03-01), Huffman
patent: 5206788 (1993-04-01), Larson et al.
patent: 5504993 (1996-04-01), Szerlip et al.
patent: 5745334 (1998-04-01), Hoffarth et al.
patent: 5795799 (1998-08-01), Hosoya
patent: 5796572 (1998-08-01), Kawai
patent: 5800575 (1998-09-01), Lucas
patent: 5889647 (1999-03-01), Hansen et al.
patent: 5912044 (1999-06-01), Farooq et al.
patent: 5952040 (1999-09-01), Yadav et al.
patent: 5978207 (1999-11-01), Anderson et al.
patent: 5989935 (1999-11-01), Abbott et al.
patent: 6043973 (2000-03-01), Nagashima et al.
patent: 6058004 (2000-05-01), Duva et al.
patent: 6125027 (2000-09-01), Klee et al.
patent: 6178082 (2001-01-01), Farooq et al.
patent: 6180252 (2001-01-01), Farrell et al.
patent: 6207552 (2001-03-01), Hunt et al.
patent: 6214445 (2001-04-01), Kanbe et al.
patent: 6216324 (2001-04-01), Farooq et al.
patent: 6226172 (2001-05-01), Sato et al.
patent: 6351368 (2002-02-01), Kim
patent: 6366444 (2002-04-01), Yagi
patent: 6372286 (2002-04-01), Azuma et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6433993 (2002-08-01), Hunt et al.
patent: 6437970 (2002-08-01), Lee et al.
patent: 6477034 (2002-11-01), Chakravorty et al.
patent: 6524352 (2003-02-01), Adae-Amoakoh et al.
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6586791 (2003-07-01), Lee et al.
patent: 6597068 (2003-07-01), Petrarca et al.
patent: 6617681 (2003-09-01), Bohr
patent: 6623865 (2003-09-01), Zou et al.
patent: 6631551 (2003-10-01), Bowles et al.
patent: 6638378 (2003-10-01), O'Bryan et al.
patent: 6672912 (2004-01-01), Figueroa
patent: 6678145 (2004-01-01), Naito et al.
patent: 6775150 (2004-08-01), Chakravorty et al.
patent: 6795296 (2004-09-01), Palanduz et al.
patent: 6891258 (2005-05-01), Alexander et al.
patent: 6907658 (2005-06-01), Li
patent: 6909593 (2005-06-01), Kuroda et al.
patent: 6937035 (2005-08-01), Kawaike et al.
patent: 6980416 (2005-12-01), Sakaguchi et al.
patent: 7038235 (2006-05-01), Seitz
patent: 7072167 (2006-07-01), Borland
patent: 2001/0019144 (2001-09-01), Roy
patent: 2001/0054748 (2001-12-01), Wikborg et al.
patent: 2002/0058163 (2002-05-01), Uzoh
patent: 2002/0080551 (2002-06-01), Kitagawa et al.
patent: 2002/0081838 (2002-06-01), Bohr
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2003/0016026 (2003-01-01), Kawaike et al.
patent: 2003/0039813 (2003-02-01), Kitai et al.
patent: 2003/0136997 (2003-07-01), Shioga et al.
patent: 2003/0170432 (2003-09-01), Kobayashi et al.
patent: 2003/0174994 (2003-09-01), Garito et al.
patent: 2003/0184953 (2003-10-01), Lee et al.
patent: 2003/0207150 (2003-11-01), Maria et al.
patent: 2003/0230768 (2003-12-01), Seitz
patent: 2004/0027813 (2004-02-01), Li
patent: 2004/0065912 (2004-04-01), Liu et al.
patent: 2004/0081760 (2004-04-01), Burns et al.
patent: 2004/0081811 (2004-04-01), Casper et al.
patent: 2004/0089471 (2004-05-01), Andoh et al.
patent: 2004/0126484 (2004-07-01), Croswell et al.
patent: 2004/0175585 (2004-09-01), Zou et al.
patent: 2004/0238957 (2004-12-01), Akram et al.
patent: 2004/0257749 (2004-12-01), Otsuka et al.
patent: 2005/0011857 (2005-01-01), Borland et al.
patent: 2005/0118482 (2005-06-01), Sriramulu et al.
patent: 2005/0151156 (2005-07-01), Wu et al.
patent: 2005/0213020 (2005-09-01), Takeda et al.
patent: 2006/0099803 (2006-05-01), Min
patent: 2006/0143886 (2006-07-01), Srinivasan et al.
patent: 0977218 (2000-02-01), None
patent: 62250626 (1987-10-01), None
patent: 02-005507 (1990-01-01), None
patent: 03/178112 (1991-08-01), None
patent: 03208323 (1991-09-01), None
patent: 05074651 (1993-03-01), None
patent: 07122456 (1995-12-01), None
patent: 2002-297939 (2001-10-01), None
patent: 2002075782 (2002-03-01), None
patent: 2002/305125 (2002-10-01), None
patent: 2002305125 (2002-10-01), None
patent: 2003163559 (2003-06-01), None
patent: 2003197463 (2003-07-01), None
Ohly, C., et al., “Defects in alkaline earth titanate thin films—the conduction behavior of doped BST,” Integrated Ferroelectronics, 2001, vol. 38, pp. 229-237.
Ohly, C., et al., “High temperature conductivity behavior of doped SrTiO3 thin films,” Integrated Ferroelectronics, 2001, vol. 33, pp. 363-372.
Ohly, C., et al., “Electrical conductivity and segregation effects of doped SrTiO3 thin films,” Journal of European Ceramic Society, 21 (2001) 1673-1676.
PCT Search Report and Written Opinion for PCT Appln. No. PCT/US2005/037626, mailed May 8, 2006 (9 pages).
Office Action for U.S. Appl. No. 11/172,544, mailed Dec. 15, 2006 (12 pages).
Office Action for U.S. Appl. No. 10/974,139, mailed Dec. 13, 2006 (11 pages).
Office Action for U.S. Appl. No. 10/971,829, mailed Jan. 3, 2007(8 pages).
Felten, J, et al.: Embedded Ceramic Resistors and Capacitors in PWB: Process and Performance, http://edc.ncms.org/ (2004) 7 pages.
Offerman, Se, et al.: Grain Nucleation and Growth During Phase Transformations, Science (2002) 298:1003-1005.
Office Action for U.S. Appl. No. 10/882,745, mailed Sep. 27, 2007 (15 pages).
Office Action for U.S. Appl. No. 10/974,139, mailed Oct. 9, 2007 (14 pages).
Office Action for U.S. Appl. No. 10/976,425, mailed Sep. 26, 2007 (10 pages).
Office Action for U.S. Appl. No. 11/096,313, mailed Oct. 18, 2007 (19 pages).
Office Action for U.S. Appl. No. 11/172,544, mailed Oct. 10, 2007 (16 pages).
Office Action for U.S. Appl. No. 10/882,745, mailed Mar. 17, 2005 (12 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Oct. 4, 2005 (10 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Apr. 3, 2006 (9 pgs).
Office Action for U. S. Appl. No. 10/882,745, mailed Aug. 30, 2006 (12 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Jan. 10, 2007 (13 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed May 1, 2007 (12 pgs).
Office Action for U.S. Appl. No. 10/971,829, mailed Mar. 8, 2006 (8 pgs).
Office Action for U.S. Appl. No. 10/971,829, mailed Aug. 14, 2006 (8 pgs).
Office Action for U.S. Appl. No. 10/974,139, mailed Mar. 9, 2006 (10 pgs).
Office Action for U.S. Appl. No. 10/974,139, mailed Apr. 17, 2007 (12 pgs).
Office Action for U.S. Appl. No. 10/976,425, mailed Mar. 26, 2007 (7 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed Aug. 14, 2006 (10 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed Nov. 29, 2006 (12 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed Feb. 20, 2007 (4 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed May 31, 2007 (16 pgs).
PCT International Search Report dated Nov. 4, 2005, PCT/US2005/022356, filed Jun. 23, 2005.
Article on the web on Answers.com about different ceramic material from Wikipedia <http://www.answers.com/topic/ceramics?cat=technology> (7 pages).
Imanaka, Yoshihiko et al., “Decoupling Capacitor with Low Inductance for High-Frequency Digital Applications,” Fujitsu

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-k thin film grain size control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-k thin film grain size control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-k thin film grain size control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4076790

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.