Adhesive system for supporting thin silicon wafer

Details Adhesive system for supporting thin silicon wafer Adhesive system for supporting thin silicon wafer

2005-09-30

2008-12-09

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21567, C438S458000

Reexamination Certificate

active

07462551

ABSTRACT:
In some embodiments, an adhesive system for supporting thin silicon wafer is presented. In this regard, a method is introduced to bond a silicon wafer to a translucent carrier through the use of an adhesive. Other embodiments are also disclosed and claimed.

REFERENCES:
patent: 6245593 (2001-06-01), Yoshihara et al.
patent: 6982184 (2006-01-01), Silverbrook
U.S. Appl. No. 11/173,857, filed Jun. 30, 2005 Inventor: Leonel R. Arana et al Entitled: Method of Supporting Microelectric Wafer During Backside Processing using Carrier Having Radiation Absorbing Film Thereon.

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