4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

David L. Guglielmi

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Adhesive system for supporting thin silicon wafer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Alternative to desmear for build-up roughening and copper...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Carbon nanotubes with controlled diameter, length, and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Circuit for enabling dual mode safe power-on sequencing

Electrical computers and digital processing systems: support – Computer power control
Reexamination Certificate

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Component-less termination for electromagnetic couplers used...

Wave transmission lines and networks – Coupling networks – Nonreciprocal gyromagnetic type
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Profile ID: LFUS-PAI-P-2196022

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