Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S199000, C438S305000, C257SE21335, C257SE21634

Reexamination Certificate

active

07432146

ABSTRACT:
To make it possible to obtain a sharp impurity profile without presenting a disadvantage such as an increase in parasitic resistance or the like using a laser annealing method to thereby meet sufficiently the requirements for making a semiconductor element finer and more highly integrated. A gate electrode is pattern formed above a semiconductor substrate made of n-type silicon single crystal through a gate insulating film. Thereafter, atoms, Ge+here, having properties just enough to amorphize single crystal Si are ion implanted (shown by arrows) from oblique directions to the Si surface of the substrate with the gate electrode as a mask to melt and re-crystallize the single crystal Si so as to form amorphous regions which seep into the substrate under the gate electrode. Thereafter B+ions are implanted into the amorphous regions and laser irradiation is executed thereon.

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