Method for manufacturing device isolation film of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S296000, C438S437000, C438S743000, C438S770000, C438S954000

Reexamination Certificate

active

07338850

ABSTRACT:
A method for manufacturing device isolation film of semiconductor device is disclosed. The method utilizes a plasma oxidation of a liner nitride film exposed by etching a liner oxide the film in peripheral region prior to the formation of device isolation film to prevent the generation of a electron trap which causes trapping of electrons at the interface of the oxide film and the nitride film resulting in a HEIP phenomenon.

REFERENCES:
patent: 5960276 (1999-09-01), Liaw et al.
patent: 6306720 (2001-10-01), Ding
patent: 6383861 (2002-05-01), Gonzalez et al.
patent: 6486517 (2002-11-01), Park
patent: 6548406 (2003-04-01), Lai et al.
patent: 6919251 (2005-07-01), Rotondaro et al.
patent: 7163869 (2007-01-01), Kim et al.
patent: 7179717 (2007-02-01), Sandhu et al.
patent: 7199022 (2007-04-01), Yasui et al.
patent: 2003/0211692 (2003-11-01), Lee
patent: 2004/0198019 (2004-10-01), Yasui et al.
patent: 2005/0026390 (2005-02-01), Chi
patent: 2005/0205948 (2005-09-01), Rotondaro et al.
patent: 2005/0285179 (2005-12-01), Violette
patent: 2006/0264003 (2006-11-01), Eun

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