Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-05-27
2008-05-27
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C361S751000, C029S825000, C439S709000
Reexamination Certificate
active
11447584
ABSTRACT:
A metal electroplating process of an electrically connecting pad structure of a circuit board and structure thereof are proposed. First, a circuit board with a patterned circuit layer formed on at least one surface thereof is provided, wherein the circuit layer defines a plurality of electrically connecting pads and electroplating lines connected to the electrically connecting pads. Then, a patterned resist layer is formed on the circuit layer of the circuit board with the electroplating lines being covered by the patterned resist layer and the electrically connecting pads being exposed from the patterned resist layer. Subsequently, an electroplating process is performed so as to form a metal protection layer on the electrically connecting pads exposed from the patterned resist layer. Then, the resist layer is removed and a solder mask layer is formed on the circuit board. The electrically connecting pads with the metal protection layer thereon and the electroplating lines are exposed from the solder mask layer. Afterwards, the electroplating lines that are not covered by the metal protection layer and exposed from the solder mask layer are removed such that a broken circuit can be formed between the electrically connecting pads and the electroplating lines. Therefore, metal permeation of the prior art is avoided and product yield is increased.
REFERENCES:
patent: 6673711 (2004-01-01), Tong et al.
patent: 2004/0099961 (2004-05-01), Chu et al.
patent: 2006/0055023 (2006-03-01), Ho et al.
patent: 2006/0125075 (2006-06-01), Liao et al.
Coleman W. David
Phoenix Precision Technology Corporation
Sawyer Law Group LLP
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