Method of making stacked die package

Details Method of making stacked die package Method of making stacked die package

2008-05-27

2008-05-27

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000

Reexamination Certificate

active

11524457

ABSTRACT:
A method of making a stacked die package (39) includes placing a first flip chip die (16) on a base carrier (12) and electrically connecting the first flip chip die (16) to the base carrier (12). A second flip chip die (18) is attached back-to-back to the first flip chip die (16) and electrically connected to the base carrier (12) with a plurality of insulated wires (20). A mold compound (36) is formed over the first and second dice and one surface of the base carrier.

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