Nitriding method of gate oxide film

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

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Details

Other Related Categories

C438S769000, C257SE21193, C257SE21209

Type

Reexamination Certificate

Status

active

Patent number

11616217

Description

ABSTRACT:
A substrate processing method comprises the step of forming an oxide film on a silicon substrate surface, and introducing nitrogen atoms into the oxide film by exposing the oxide film to nitrogen radicals excited in plasma formed by a microwave introduced via a planar antenna.

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Gerald Lucovsky “Silicon Oxide/Silicon Nitride Dual-Layer Films: a stacked gate dielectric for the 21st century” Journal of Non-Crystalline Solids vol. 254 (1999), pp. 26-37.
U.S. Appl No. 11/616,217, filed Dec. 26, 2006, Matsuyama, et al.
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