Semiconductor package including a semiconductor device, and...

Details Semiconductor package including a semiconductor device, and... Semiconductor package including a semiconductor device, and...

2008-09-02

2008-09-02

Nguyen, Dao H (Department: 2818)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S263000, C257S686000, C257S777000, C257SE21502, C257SE21503

Reexamination Certificate

active

11048870

ABSTRACT:
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body.

REFERENCES:
patent: 5468694 (1995-11-01), Taguchi et al.
patent: 5909633 (1999-06-01), Haji et al.
patent: 6756663 (2004-06-01), Shiraishi et al.
patent: 6862189 (2005-03-01), Higuchi
patent: 7193311 (2007-03-01), Ogawa et al.
patent: 8-264581 (1996-10-01), None
patent: 10-19960000220 (1996-01-01), None
patent: 2002-0072595 (2002-09-01), None
Korean Office Action dated Mar. 22, 2006 w/English translation.

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