Semiconductor devices having a via hole and methods for...

Details Semiconductor devices having a via hole and methods for... Semiconductor devices having a via hole and methods for...

2007-08-21

2007-08-21

Deo, Duy-Vu N. (Department: 1765)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S623000

Reexamination Certificate

active

10922756

ABSTRACT:
Semiconductor devices having a via hole and methods for forming a via hole in a semiconductor device are disclosed. A disclosed method comprises performing a first etching process on an insulating layer to form a via hole, and performing a second etching process to enlarge a bottom of the via hole.

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patent: 10-1998-0028414 (2000-02-01), None
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