Methods and fixture for coupling a lid to a support substrate

Details Methods and fixture for coupling a lid to a support substrate Methods and fixture for coupling a lid to a support substrate

2007-08-14

2007-08-14

Menz, Douglas M. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000

Reexamination Certificate

active

10859673

ABSTRACT:
A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.

REFERENCES:
patent: 5907474 (1999-05-01), Dolbear
patent: 5926371 (1999-07-01), Dolbear
patent: 6136128 (2000-10-01), Chung
patent: 6392145 (2002-05-01), Andric
patent: 6504243 (2003-01-01), Andric et al.

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