Method of making semiconductor package with heat spreader

Details Method of making semiconductor package with heat spreader Method of making semiconductor package with heat spreader

2007-12-25

2007-12-25

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S106000, C438S112000, C438S122000, C438S124000, C438S126000, C438S127000, C257S796000, C257S790000, C257S783000, C257S792000, C257S709000, C257S706000, C257S717000

Reissue Patent

active

10934632

ABSTRACT:
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.

REFERENCES:
patent: 5450283 (1995-09-01), Lin et al.
patent: 5471366 (1995-11-01), Ozawa
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5726079 (1998-03-01), Johnson
patent: 5834850 (1998-11-01), Hotta et al.
patent: 5904505 (1999-05-01), Hotta et al.
patent: 5929514 (1999-07-01), Yalamanchili
patent: 6117797 (2000-09-01), Hembree
patent: 6144108 (2000-11-01), Ohizumi et al.
patent: 6458626 (2002-10-01), Huang et al.
patent: 6596565 (2003-07-01), Hembree
patent: 6787929 (2004-09-01), Yoshihara et al.
patent: 2003/0011064 (2003-01-01), Combs et al.
patent: 356133857 (1981-10-01), None
patent: 61-49446 (1986-03-01), None
patent: 61-194861 (1986-08-01), None
patent: 90118118 (2001-07-01), None
Shaukatullah, “Thermal Enhancement of Surface Mount Electronic Packages with Heat Sinks”, 1993 IEEE, p. 256-263.*

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