Structure and fabrication method of electrostatic discharge...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C438S309000, C438S322000

Reexamination Certificate

active

10951373

ABSTRACT:
A structure of an electrostatic discharge protection circuit, in which a buried layer is formed in the substrate of the electrostatic discharge protection circuit, and a sinker layer electrically connected to the buried layer and a drain is also formed therein. Thereby, when the electrostatic discharge protection circuit is activated, the current flows from a source through the buried layer and the sinker layer to the drain. The current flow path is remote from the gate dielectric layer to avoid damaging the gate dielectric by a large current, so as to improve the dielectric strength of the electrostatic discharge protection circuit.

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patent: 6424013 (2002-07-01), Steinhoff et al.
patent: 6525376 (2003-02-01), Harada et al.
patent: 6570229 (2003-05-01), Harada
patent: 2001/0002059 (2001-05-01), Wong et al.
patent: 2002/0050619 (2002-05-01), Kawaguchi et al.
patent: 2002/0142507 (2002-10-01), Egashira
patent: 2003/0049907 (2003-03-01), Omi et al.

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