Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2007-04-10
2007-04-10
Smith, Bradley K. (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C257S417000, C257SE21499, C073S504140
Reexamination Certificate
active
10933853
ABSTRACT:
The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, attaching the resonator wafer to a base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and attaching a cap wafer on top of the base wafer. The present invention relates further to a gyroscope containing an integrated post with on or off-chip electronics.
REFERENCES:
patent: 5001940 (1991-03-01), Ogawa
patent: 5134881 (1992-08-01), Henrion et al.
patent: 5203208 (1993-04-01), Bernstein
patent: 5313835 (1994-05-01), Dunn
patent: 5377544 (1995-01-01), Dunn
patent: 5490420 (1996-02-01), Burdess
patent: 5511419 (1996-04-01), Dunn
patent: 5756895 (1998-05-01), Kubena et al.
patent: 5894090 (1999-04-01), Tang et al.
patent: 6079272 (2000-06-01), Stell et al.
patent: 6164134 (2000-12-01), Cargille
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6405594 (2002-06-01), Tang et al.
patent: 6487907 (2002-12-01), Tang et al.
patent: 6539801 (2003-04-01), Gutierrez et al.
patent: 6555404 (2003-04-01), Kubena et al.
patent: 6584845 (2003-07-01), Gutierrez et al.
patent: 6629460 (2003-10-01), Challoner
patent: 6698287 (2004-03-01), Kubena et al.
patent: 6758093 (2004-07-01), Tang et al.
patent: 6796179 (2004-09-01), Bae et al.
patent: 6841838 (2005-01-01), Kubena et al.
patent: 6944931 (2005-09-01), Shcheglov et al.
patent: 7015060 (2006-03-01), Kubena et al.
patent: 2003/0217915 (2003-11-01), Ouellet et al.
patent: 2003/0230798 (2003-12-01), Lin et al.
patent: 2004/0016995 (2004-01-01), Kuo et al.
patent: 2004/0077117 (2004-04-01), Ding et al.
patent: 2004/0099909 (2004-05-01), Park et al.
patent: 2004/0237626 (2004-12-01), Challoner et al.
patent: 2005/0054133 (2005-03-01), Felton et al.
Johnson, J.J., et al., “Fabrication of Silicon Masters for Micro-contact Printing,”National Nanofabrication Users Network,The Penn State Nanofabrication Facility, pp. 48-49 (2000).
Milanovic, V., et al., “A Simple Process for Lateral Single Crystal Silicon Nanowires,”Proceedings of IMECE '02, ASME International Mechanical Engineering Congress&Exposition,New Orleans, Louisiana, pp. 1-7 (Nov. 17-22, 2002).
Milanovic, V, et al., “Deep Reactive Ion Etching for Lateral Field Emission Devices,”IEEE Electron Device Letters,vol. 21, No. 6, pp. 271-273 (Jun. 2000).
Tang, T.K., et al., “Silicon Bulk Micromachined Vibratory Gyroscope,”Solid-State Sensor and Actuator Workshop,Hilton Head, South Carolina, pp. 288-293 (Jun. 2-6, 1996).
Via, A., et al., “Metal Lift-Off on InP HBTs Using Carbon Dioxide Snow Spray,” INTERNET: http://www1.boc.com/eco-snow/pdf/CS-MAX%202002.pdf.
U.S. Appl. No. 11/008,715, filed Dec. 8, 2004, Kubena.
U.S. Appl. No. 11/008,721, filed Dec. 8, 2004, Kubena et al.
Chang David T.
Kubena Randall L.
Stratton Frederic P.
Fulk Steven J.
Ladas & Parry LLP
Smith Bradley K.
LandOfFree
Method of manufacturing a cloverleaf microgyroscope and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a cloverleaf microgyroscope and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a cloverleaf microgyroscope and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3784383