Stacked die module and techniques for forming a stacked die...

Details Stacked die module and techniques for forming a stacked die... Stacked die module and techniques for forming a stacked die...

2007-03-06

2007-03-06

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

C438S011000, C438S018000, C438S109000, C438S142000, C438S406000, C257S048000, C257S686000, C257S777000, C324S252000, C324S071500, C324S719000, C324S765010

Reexamination Certificate

active

11266972

ABSTRACT:
Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least two semiconductor die to a substrate. Further, present embodiments include testing the semiconductor die in the die stack after the die stack is formed and prior to attaching either of the at least two semiconductor die to the substrate.

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