Tape package having test pad on reverse surface and method...

Details Tape package having test pad on reverse surface and method... Tape package having test pad on reverse surface and method...

2007-05-15

2007-05-15

Le, Thao X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S667000, C257SE23065, C349S150000, C349S151000

Reexamination Certificate

active

10753828

ABSTRACT:
A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card can be used. A pitch between the test pads is wide so that the accuracy in an electric test of the tape package is increased. A total length of the tape package is reduced.

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English language abstract of Korean Publication No. 10-0240818.
English language abstract of Korean Publication No. 10-0315138.
English Abstract of JP5013498.

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