Premature breakdown in submicron device geometries

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S309000

Reexamination Certificate

active

10302256

ABSTRACT:
The concept of the present invention describes a semiconductor device with a junction504between a lightly doped region501and a heavily doped region502, wherein the junction has an elongated portion504aand curved portions504b. The doping concentration of the lightly doped region is configured so that it exhibits higher resistivity in the proximity510of the curved portion by an amount suitable to lower the electric field strength during device operation and thus to offset the increased field strength caused by the curved portion. As a consequence, the device breakdown voltage in the curved junction portion becomes equal to or greater than the breakdown voltage in the linear portion.

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