Structure having an integrated circuit on another integrated...

Details Structure having an integrated circuit on another integrated... Structure having an integrated circuit on another integrated...

2007-03-27

2007-03-27

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23067, C257SE25013, C257SE25006, C257SE25029, C257S686000, C257S685000, C257S777000, C257S723000, C257S780000, C257S737000, C257S738000, C257S690000, C257S692000, C257S693000, C257S675000

Reexamination Certificate

active

11108223

ABSTRACT:
Two or more semiconductor packages are stacked with an intervening element that is positioned between within an area surrounded by conductive bumps of a bottom surface of the overlying package. Different shapes of the intervening element are used depending upon how many sides of the bottom surface have conductive bumps. In one form the intervening element extends laterally from the stack and is bent downward to contact or extend through an underlying substrate. Contact to the intervening element at the backside of the substrate may be made. In another form the intervening element is bent upward for enhancing thermal properties. The intervening element is adhesive to prevent non-destructive removal of the packages thereby adding increased security for information contained within the packages. Selective electrical shielding between packages is also provided.

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