Method of forming a solder ball on a board and the board

Details Method of forming a solder ball on a board and the board Method of forming a solder ball on a board and the board

2007-05-08

2007-05-08

Pert, Evan (Department: 2826)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C438S613000, C361S767000

Reexamination Certificate

active

11196243

ABSTRACT:
In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.

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