4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

Sang-Ho Ahn

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Method of forming a solder ball on a board and the board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Semiconductor chip stack structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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TFT structure for high resolution digital X-ray detector

Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system
Reexamination Certificate

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Ultra-thin semiconductor package device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Ultra-thin semiconductor package device and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2876285

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