Semiconductor integrated circuit device and method for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S216000, C438S275000

Reexamination Certificate

active

07118949

ABSTRACT:
In a semiconductor integrated circuit device having a system-on-chip structure in which a DRAM and a logic integrated circuit are mixedly mounted on a chip, a silicide layer is formed on the surfaces of the source and the drain of a MISFET of a direct peripheral circuit of the DRAM, the surfaces of the source and the drain of a MISFET of an indirect peripheral circuit of the DRAM, and the surfaces of the source and the drain of a MISFET of the logic integrated circuit, and the silicide layer is not formed on the surfaces of the source and the drain of a memory cell selective MISFET of the memory cell of the DRAM.

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Fujii et al, “A Thermally Stable Ti-W Salicide For Deep-Submicron Logic With Embedded DRAM”, IEDM, 1996, pp. 451-454.

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