Common connection method for flip-chip assembled devices

Details Common connection method for flip-chip assembled devices Common connection method for flip-chip assembled devices

2006-12-05

2006-12-05

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S686000, C438S108000

Reexamination Certificate

active

07145248

ABSTRACT:
The planes of chips in a flip-chip arrangement, when at least one of the chips has an insulating layer running through it, may be electrically connected together by incorporating into the top chip a flexible metalized structure which is pinned to the top layer of the bottom chip using a wire bond ball which is connected to a wire that is attached to a pad on the top layer of the upper chip. A single connection connects both layers of the top chip to the layer on the bottom chip. The flexible structure may be similar to a collapsible cup with a hole in the middle or it may be a tiltable micro mirror.

REFERENCES:
patent: 5177669 (1993-01-01), Juskey et al.
patent: 6683384 (2004-01-01), Kossives et al.
patent: 0486829 (1992-05-01), None

Affiliated with

Also associated with

Rating

Common connection method for flip-chip assembled devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Common connection method for flip-chip assembled devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Common connection method for flip-chip assembled devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3710318