Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2006-08-08
2006-08-08
Lindsay, Jr., Walter L. (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S256000, C438S381000
Reexamination Certificate
active
07087479
ABSTRACT:
Contacts are formed to integrated circuit devices by first forming a conductive layer (80) on a semiconductor device. An optional dielectric layer (130) is formed over the conductive layer and a carbon containing dielectric layer (140) is formed over the optional dielectric layer (130). Contacts are formed to the conductive layer (80) by etching openings in the carbon containing dielectric layer (140) and the optional dielectric layer (130).
REFERENCES:
patent: 6236091 (2001-05-01), Ngo et al.
patent: 6596581 (2003-07-01), Park et al.
patent: 2001/0046784 (2001-11-01), Broekaart et al.
patent: 2002/0192943 (2002-12-01), Tsai et al.
patent: 2003/0027385 (2003-02-01), Park et al.
patent: 199 37 214 (2000-02-01), None
patent: 0 849 785 (1998-06-01), None
patent: 2 357 186 (2001-06-01), None
patent: 10321838 (1998-12-01), None
patent: WO 00/67304 (2000-11-01), None
Howard Gregory E.
Swanson Leland S.
Brady III W. James
Lindsay Jr. Walter L.
McLarty Peter K.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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