Method of forming integrated circuit contacts

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S256000, C438S381000

Reexamination Certificate

active

07087479

ABSTRACT:
Contacts are formed to integrated circuit devices by first forming a conductive layer (80) on a semiconductor device. An optional dielectric layer (130) is formed over the conductive layer and a carbon containing dielectric layer (140) is formed over the optional dielectric layer (130). Contacts are formed to the conductive layer (80) by etching openings in the carbon containing dielectric layer (140) and the optional dielectric layer (130).

REFERENCES:
patent: 6236091 (2001-05-01), Ngo et al.
patent: 6596581 (2003-07-01), Park et al.
patent: 2001/0046784 (2001-11-01), Broekaart et al.
patent: 2002/0192943 (2002-12-01), Tsai et al.
patent: 2003/0027385 (2003-02-01), Park et al.
patent: 199 37 214 (2000-02-01), None
patent: 0 849 785 (1998-06-01), None
patent: 2 357 186 (2001-06-01), None
patent: 10321838 (1998-12-01), None
patent: WO 00/67304 (2000-11-01), None

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