Method for fabricating a field-effect transistor having a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S659000, C438S766000, C438S595000, C438S528000

Reexamination Certificate

active

07060558

ABSTRACT:
In the course of a method for fabricating a field-effect transistor having a floating gate, a structure is formed which has uncovered sidewalls of a layer made of the material for forming the floating gate and which is exposed to an oxidizing atmosphere in order to coat the sidewalls. At the same time, other regions of the structure have an insulating oxide layer. At a point in time prior to the action of an oxidizing atmosphere, nitrogen is implanted into the material of the floating gate in a quantity that appreciably reduces the oxidation at the sidewalls thereof.

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Kusunoki, S. et al.: “Hot-Carrier-Resistant Structure by Re-Oxidized Nitrided Oxide Sidewall for Highly Reliable and High Performance LDD MOSFETs”. IEEE, 1991, pp. 649-652.
Doyle, B. et al.: “Simultaneous Growth of Different Thickness Gate Oxides in Silicon CMOS Processing”, IEEE Electron Device Letters, vol. 16, No. 7, Jul. 1995, pp. 301-302.

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