Positive-working chemical-amplification photoresist composition

Details Positive-working chemical-amplification photoresist composition Positive-working chemical-amplification photoresist composition

2006-12-12

2006-12-12

Lee, Sin (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S910000, C430S914000, C430S921000, C430S925000

Reexamination Certificate

active

07147984

ABSTRACT:
Disclosed is a positive-working chemical-amplification photoresist composition used in the patterning works in the manufacture of semiconductor devices, with which quite satisfactory patterning of a photoresist layer can be accomplished even on a substrate surface provided with an undercoating film of silicon nitride, phosphosilicate glass, borosilicate glass and the like in contrast to the prior art using a conventional photoresist composition with which satisfactory patterning can hardly be accomplished on such an undercoating film. The photoresist composition comprises, besides a film-forming resin capable of being imparted with increased solubility in an alkaline solution by interacting with an acid and a radiation-sensitive acid-generating compound, a phosphorus-containing oxo acid such as phosphoric acid and phosphonic acid or an ester thereof.

REFERENCES:
patent: 5272035 (1993-12-01), Sekiya
patent: 5393624 (1995-02-01), Ushijima
patent: 5565304 (1996-10-01), Honda
patent: 5716753 (1998-02-01), Yoshimoto et al.
patent: 5744281 (1998-04-01), Niki et al.
patent: 5759739 (1998-06-01), Takemura et al.
patent: 5800966 (1998-09-01), Ueda et al.
patent: 5852128 (1998-12-01), Padmanaban et al.
patent: 5861231 (1999-01-01), Barclay et al.
patent: 6136500 (2000-10-01), Kobayashi et al.
patent: 6187504 (2001-02-01), Suwa et al.
patent: 6255041 (2001-07-01), Oomori et al.
patent: 6340553 (2002-01-01), Oomori et al.
patent: 6387587 (2002-05-01), Oomori et al.
patent: 6815144 (2004-11-01), Oomori et al.
patent: 6869745 (2005-03-01), Oomori et al.
patent: 6890697 (2005-05-01), Oomori et al.
patent: 1 447956 (1968-11-01), None
patent: 25 09 824 (1975-09-01), None
patent: 0 540 032 (1993-05-01), None
patent: 0 653 681 (1995-05-01), None
patent: 0 701 173 (1996-03-01), None

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