Hermetic thin film metallized sealband for SCM and MCM-D modules

Details Hermetic thin film metallized sealband for SCM and MCM-D modules Hermetic thin film metallized sealband for SCM and MCM-D modules

1996-10-24

2000-04-04

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438108, 438118, 438125, 438126, H01L 2144

Patent

active

060460741

ABSTRACT:
A module for encapsulating a microelectronic device has a polished mating surface around the periphery of the substrate on which is deposited at least one thin film sealband fabricated at a temperature no greater than about 400.degree. C. The sealband has a thickness of less than about 0.001 in. and comprising a metal capable of wetting molten solder which has a melting point no greater than about 400.degree. C. and adhering to the solder after solidification. A layer of the solder is disposed between the sealbands of the cap and substrate forming a hermetic seal for the module.

REFERENCES:
patent: 3107756 (1963-10-01), Gallet
patent: 3619233 (1971-11-01), Grove et al.
patent: 3638076 (1972-01-01), Koons
patent: 3770404 (1973-11-01), Koons
patent: 3936864 (1976-02-01), Benjamin
patent: 3946190 (1976-03-01), Hascoe
patent: 3957538 (1976-05-01), Fairweather et al.
patent: 4094514 (1978-06-01), Johnson
patent: 4142203 (1979-02-01), Dietz
patent: 4212349 (1980-07-01), Andros et al.
patent: 4261584 (1981-04-01), Browne et al.
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4294729 (1981-10-01), Bakos et al.
patent: 4313492 (1982-02-01), Andros et al.
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4401766 (1983-08-01), Kyle
patent: 4410647 (1983-10-01), Susko et al.
patent: 4411680 (1983-10-01), Kyle
patent: 4463315 (1984-07-01), Kutzler
patent: 4471259 (1984-09-01), Stoermer et al.
patent: 4601958 (1986-07-01), Levine
patent: 4603345 (1986-07-01), Lee et al.
patent: 4610934 (1986-09-01), Boecker et al.
patent: 4657337 (1987-04-01), Kyle
patent: 4722586 (1988-02-01), Dodson et al.
patent: 4746583 (1988-05-01), Falanga
patent: 4750665 (1988-06-01), Falanga
patent: 4764846 (1988-08-01), Go
patent: 4806704 (1989-02-01), Belke, Jr. et al.
patent: 4824123 (1989-04-01), Chia et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4871108 (1989-10-01), Boecker et al.
patent: 5001546 (1991-03-01), Butt
patent: 5016138 (1991-05-01), Woodman
patent: 5032788 (1991-07-01), Ringleb et al.
patent: 5132185 (1992-07-01), Iacovangelo
patent: 5134461 (1992-07-01), Yamakawa et al.
patent: 5139972 (1992-08-01), Neugebauer et al.
patent: 5183269 (1993-02-01), Black et al.
patent: 5188280 (1993-02-01), Nakao et al.
patent: 5229727 (1993-07-01), Clark et al.
patent: 5247779 (1993-09-01), Wirsig et al.
patent: 5276455 (1994-01-01), Fitzsimmons et al.
patent: 5280413 (1994-01-01), Pai
patent: 5302219 (1994-04-01), Hargis
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5336928 (1994-08-01), Neugebauer et al.
patent: 5337588 (1994-08-01), Chhatwal
patent: 5378313 (1995-01-01), Pace
patent: 5447886 (1995-09-01), Rai
patent: 5616520 (1997-04-01), Nishiuma et al.
patent: 5744752 (1998-04-01), McHerron et al.
patent: 5945735 (1999-08-01), Economilkos et al.
"Micro Carrier for LSI Chip Used in the HITAC M-880 Processor Group", 41st ECTC Papers, pp.704-711, 1991.
"Inexpensive Cap Hermetic Encapsulation Process", Research Disclosure, No. 330, Oct. 1991.

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