4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Dale C. McHerron

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Dielectric compositions, preparation thereof, and integrated...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Reexamination Certificate

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Hermetic thin film metallized sealband for SCM and MCM-D modules

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Hermetic thin film metallized sealband for SCM and MCM-D modules

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Interconnect dielectric compositions, preparation thereof,...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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Process for forming an integrated circuit

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-583699

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