Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2006-08-15
2006-08-15
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S693000, C257S781000, C257S782000, C257S787000, C257SE23034, C257SE23038, C257SE23055
Reexamination Certificate
active
07091595
ABSTRACT:
The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.
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Fuergut Edward
Vilsmeier Hermann
Woerner Holger
Clark Jasmine
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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