Semiconductor device with semiconductor chip and rewiring...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Reexamination Certificate

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Details

C257S693000, C257S781000, C257S782000, C257S787000, C257SE23034, C257SE23038, C257SE23055

Reexamination Certificate

active

07091595

ABSTRACT:
The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

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patent: 5767570 (1998-06-01), Rostoker
patent: 6309910 (2001-10-01), Haba et al.
patent: 6541871 (2003-04-01), Pai et al.
patent: 6646335 (2003-11-01), Emoto
patent: 6787393 (2004-09-01), Jin et al.
patent: 2002/0163077 (2002-11-01), Kuwahara et al.
patent: 0 915 505 (1999-05-01), None
patent: 56-122157 (1981-09-01), None
patent: WO 03/015165 (2003-02-01), None

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