Atomic layer deposition apparatus

Details Atomic layer deposition apparatus Atomic layer deposition apparatus

2006-08-01

2006-08-01

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C438S478000, C118S719000, C118S729000

Reexamination Certificate

active

07085616

ABSTRACT:
A method and apparatus for atomic layer deposition (ALD) is described. The apparatus comprises a deposition chamber and a wafer support. The deposition chamber is divided into two or more deposition regions that are integrally connected one to another. The wafer support is movable between the two or more interconnected deposition regions within the deposition chamber.

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