Methods of implementing and enhanced silicon-on-insulator...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S295000, C438S297000, C438S407000, C438S528000, C438S928000, C257SE21563

Reexamination Certificate

active

07129138

ABSTRACT:
Enhanced silicon-on-insulator (SOI) buried oxide (BOX) structures and methods are provided for implementing enhanced SOI BOX structures. An oxygen implant step is performed from a backside into a thinned silicon substrate layer. An anneal step forms thick buried oxide (BOX) regions from oxygen implants in the silicon substrate layer. The oxygen implant step forms an isolated region near the oxygen implants. A backside implant step selectively dopes the isolated region for forming a backgate for an SOI device being formed including a selected one of anti-fuse (AF) devices, and SOI transistors including PFET and NFET devices.

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