Method and apparatus for aligning and setting the axis of...

Details Method and apparatus for aligning and setting the axis of... Method and apparatus for aligning and setting the axis of...

2006-04-11

2006-04-11

Deo, Duy-Vu N. (Department: 1765)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C438S691000, C438S692000

Reexamination Certificate

active

07025854

ABSTRACT:
A method and apparatus is disclosed for polishing a semiconductor wafer. A polishing pad including a first surface and a semiconductor wafer including a second surface are aligned to each other. To allow alignment of an axis of rotation of the surfaces, at least one of the first and second surfaces includes an adjustable axis of rotation. After the axis of rotation of the first and second surfaces is aligned, the adjustable axis of rotation is set, preferably with a magneto-rheological fluid or similarly acting material, to maintain a fixed position. Thereafter, the polishing pad is utilized to polish the semiconductor wafer.

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Peter Godwin, “The Car That Can't Crash”, The New York Times Magazine, Jun. 11, 2000.

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