Semiconductor device having a capping layer including cobalt...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S660000

Reexamination Certificate

active

07037828

ABSTRACT:
A semiconductor device, and a method of fabricating the same, includes cobalt as a capping layer. An interconnection structure of the semiconductor device has an improved via resistance. In the semiconductor device, a single cobalt layer or a composite film including a cobalt layer and a titanium nitride layer is used as the capping layer of a metal layer.

REFERENCES:
patent: 5047367 (1991-09-01), Wei et al.
patent: 5482895 (1996-01-01), Hayashi et al.
patent: 5536684 (1996-07-01), Dass et al.
patent: 5998873 (1999-12-01), Blair et al.
patent: 6096599 (2000-08-01), Kepler et al.
patent: 6653227 (2003-11-01), Lai et al.
patent: 6916729 (2005-07-01), Fang et al.
patent: 6943110 (2005-09-01), Lur et al.
patent: 07115198 (1995-05-01), None
patent: 1996-42969 (1996-12-01), None
patent: 1999-50404 (1999-11-01), None
patent: 2000-66420 (2000-11-01), None
English language Abstract for Korean patent publication No. 2000-66420.
English language abstract for Korean Publication No. 1996-42969.
English language Abstract for Korean patent publication No. 1999-50404.

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