Method of manufacturing a superjunction device with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S212000, C438S282000, C438S289000, C438S514000

Reexamination Certificate

active

07041560

ABSTRACT:
A method of manufacturing a semiconductor device includes providing a semiconductor substrate having a heavily doped region of a first conductivity and has a lightly doped region of the first conductivity. The semiconductor substrate a plurality of trenches etched into an active region of the substrate forming a plurality of mesas. A preselected area in the active region is oxidized and then etched using a dry process oxide etch to remove the oxide in the bottoms of the trenches. A protective shield is formed over a region at a border between the active region and the termination region. The protective shield is partially removed from over the preselected area. Dopants are implanted at an angle into mesas in the preselected area. The plurality of trenches are with an insulating material, the top surface of the structure is planarized and a superjunction device is formed on the structure.

REFERENCES:
patent: 4158206 (1979-06-01), Neilson
patent: 4895810 (1990-01-01), Meyer et al.
patent: 5019522 (1991-05-01), Meyer et al.
patent: 5045903 (1991-09-01), Meyer et al.
patent: 5216275 (1993-06-01), Chen
patent: 5366914 (1994-11-01), Takahashi et al.
patent: 5435888 (1995-07-01), Kalnitsky et al.
patent: 5472888 (1995-12-01), Kinzer
patent: 5506421 (1996-04-01), Palmour
patent: 5598018 (1997-01-01), Lidow et al.
patent: 5742087 (1998-04-01), Lidow et al.
patent: 5744994 (1998-04-01), Williams
patent: 5786619 (1998-07-01), Kinzer
patent: 5902127 (1999-05-01), Park
patent: 5929690 (1999-07-01), Williams
patent: 5939754 (1999-08-01), Hoshi
patent: 6081009 (2000-06-01), Neilson
patent: 6184555 (2001-02-01), Tihanyi et al.
patent: 6190970 (2001-02-01), Liao et al.
patent: 6198127 (2001-03-01), Kocon
patent: 6214698 (2001-04-01), Liaw et al.
patent: 6222229 (2001-04-01), Herbert et al.
patent: 6239463 (2001-05-01), Williams et al.
patent: 6265281 (2001-07-01), Reinberg
patent: 6291856 (2001-09-01), Miyasaka et al.
patent: 6300171 (2001-10-01), Frisina
patent: 6307246 (2001-10-01), Nitta et al.
patent: 6359309 (2002-03-01), Liao et al.
patent: 6362505 (2002-03-01), Tihanyi
patent: 6391723 (2002-05-01), Frisina
patent: 6410958 (2002-06-01), Usui et al.
patent: 6452230 (2002-09-01), Boden, Jr.
patent: 6459124 (2002-10-01), Zhang et al.
patent: 6465325 (2002-10-01), Ridley et al.
patent: 6495421 (2002-12-01), Luo
patent: 6501130 (2002-12-01), Disney
patent: 6501146 (2002-12-01), Harada
patent: 6504230 (2003-01-01), Deboy et al.
patent: 6509220 (2003-01-01), Disney
patent: 6635906 (2003-10-01), Chen
patent: 2002/0070418 (2002-06-01), Kinzer et al.

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